| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic module which can realize thinning, and to provide a packaging method of the electronic module. SOLUTION: A submodule 1 is packaged on an upper face of a main board 10 through two or more external connection terminals 4, arranged on the rear face of a subsubstrate 3. The main board 10 with the submodule 1 mounted thereon is stored inside a case 11. A tuner 2 is mounted on the upper face of the subsubstrate 3. A quartz crystal oscillator 5 as an electronic part, having a height larger than the diameter of each outer connection terminal 4 and a bypass capacitor 6 are provided on the rear face of the subsubstrate 3. An RF(radio frequency) connector 9 is installed on the side face of the case 11. A via hole 8, having substantially square shape is made in the main board 10. When the submodule 1 is packaged on the main substrate 10, the quartz crystal oscillator 5 and the bypass capacitor 6 of the submodule 1 are inserted inside the via hole 8. COPYRIGHT: (C)2008,JPO&INPIT
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