| 摘要 |
A semiconductor package is provided to maximize a spatial area of wire bonding by modifying a shape of an electrode terminal formed on a substrate. A semiconductor package includes a substrate(23) having electrode terminals(22) and a semiconductor chip(25) having a bonding wire(24). The semiconductor package is formed by wire-bonding the electrode terminals of the substrate and the bonding wire of the semiconductor chip. The electrode terminals include a plurality of pairs of electrode terminals which are symmetrical to each other. Each of the electrodes includes a pair of patterns which are arranged in both sides of a diagonal line direction or an oblique line direction on a rectangle. |
