| 摘要 |
PROBLEM TO BE SOLVED: To form a ceramic plate precisely, and to suppress cracks on the ceramic plate caused by warpage when using a heat cycle. SOLUTION: A manufacturing method of a substrate for power modules has: a laser machining process for forming a groove-shaped scribe line 22 by irradiating a surface 21 of a ceramic base material with laser beams; a division process for dividing the ceramic base material 20 along a scribe line 22 to form the ceramic plate 11; and a brazing process for brazing a circuit layer to the ceramic base member 20 or the ceramic plate 11. By using the manufacturing method of the substrate for power modules, the substrate for power modules, where a circuit layer is brazed onto the ceramic plate 11 and a semiconductor chip is soldered to the circuit layer. In the laser machining process, YAG laser beams are used, and the surface 21 of the ceramic base material is irradiated with laser beams of which the wavelength is not less than 250 nm and is not more than 600 nm for forming the scribe line 22. COPYRIGHT: (C)2008,JPO&INPIT |
