Ceramic substrate for thin film electronic component, production method for the same and thin film electronic component using the same

摘要

A ceramic substrate for a thin film electronic component, a production method thereof, and a thin film electronic component using the ceramic substrate A first substrate ( 1 ) includes a dense glass-ceramic mixed layer ( 33 ) containing glass in its surface portion. A second substrate is prepared such that a glass layer ( 32 ) formed on a surface of a substrate base portion ( 2 ) is subjected to a heat-pressure treatment so as to form or rather partly change the glass portion ( 32 ) into a dense glass-ceramic mixed layer ( 33 ) in which glass is dispersed into a surface portion of the substrate base portion ( 2 ). A surface of the dense glass-ceramic mixed layer ( 33 ) is then subjected to grinding or rather polishing to flatten and expose a surface of the dense glass-ceramic mixed layer ( 32 ). A third substrate includes a substrate base portion ( 2 ) having a dense glass-ceramic mixed layer ( 33 ) containing glass on a surface portion in one face side, and a wiring pattern ( 21 ) formed inside the substrate base portion ( 2 ). In the wiring pattern ( 21 ), one end thereof is exposed on or from a surface of the dense glass-ceramic mixed layer ( 33 ) and the other end is exposed on or from another surface of the substrate.