| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device of a structure suitable for low-cost manufacturing which eliminates a need of molding a separate heat spreader for individual semiconductor device even when desirable heights of heat spreaders are different between a plurality of semiconductor devices, and also to provide a manufacturing apparatus and a manufacturing method for the semiconductor device. SOLUTION: The semiconductor device 1 includes: a semiconductor chip 10 mounted on a substrate 12; a heat spreader 20 disposed above the semiconductor chip 10; and a sealing resin 30 which is interposed between the semiconductor chip 10 and the heat spreader 20 to cover the semiconductor chip 10. The heat spreader 20 is put in a state of noncontact with both substrate 12 and semiconductor chip 10, and has an opening 22. COPYRIGHT: (C)2008,JPO&INPIT |
