| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a printed circuit board which is capable of preventing a surface insulating resin layer from being warped at reflow in the mounting region of a semiconductor device. <P>SOLUTION: Conductor wiring layers 12, and 14b and interlayer insulating resin layers 13 are alternately laminated on both the main surfaces of a core board 11, and a surface insulating resin layer 16 is formed covering the uppermost conductor wiring layer formed on the surface of the core board 11 for the formation of a multilayer printed circuit board 1. A square region is removed from the surface insulating resin layer 16 which is formed on the interlayer insulating resin layer 13, to form a vacant area 17 at the center within the mounting region 10 of a semiconductor device in a region just under the semiconductor device excluding conductor lands 14a bonded to the external electrodes of the semiconductor device. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
