EPOXY RESIN COMPOSITION FOR PACKAGING SEMICONDUCTOR DEVICE

摘要

An epoxy resin composition for packaging a semiconductor device is provided to reduce the problem of adhesion generated between an epoxy packaging material and a wafer chip, thereby improving reliance. An epoxy resin composition comprises 1-6 wt% of a diglycidyl ether bisphenol modified epoxy resin represented by the formula 1; 2-8 wt% of a polyaromatic epoxy resin represented by the formula 3; 1-5 wt% of a polyaromatic curing agent represented by the formula 4; 0.1-1.5 wt% of a triazine-based resin represented by the formula 6; 0.11-2.1 wt% of a coupling agent represented by X3-Si-CH2-CH2-CH2-O-CH2-R (wherein R is a cyclo epoxy group, an amino group, a methacryl group, or a vinyl group; and X are independently a methoxy group or an ethoxy group); 0.05-1 wt% of a curing accelerator; and 80-90 wt% of an inorganic filler. In the formula 1, R is a hydroxyl group or a methyl group; G is a glycidyl group; and n is an integer of 1-3. In the formulae 3 and 4, R1 and R2 are independently a C1-C4 alkyl group; a is an integer of 0-4; and n is an integer of 1-7.