摘要 |
A camera module for a mobile device is provided to guarantee stable performance of a product by preventing a PCB(Printed Circuit Board) from being bent due to thermal compression when bonded to an FPCB(Flexible PCB) while maintaining a connection structure with a socket as it is. An image sensor(3) is installed within a housing(2) and receives an image. A PCB(5) includes an attachment face at a lower surface of the housing(2) to which an upper edge portion is attached so that a lower surface thereof can be selectively connected to a terminal piece of a socket(7) or a connection pad of an FPCB. The PCB includes a board pad part which is attached to the FPCB by thermal compression to a lower edge portion corresponding to the attachment face, and a socket pad part disposed to be downscaled based on the board pad part. An insulating material is formed on the PCB by selectively applying insulating material to the board pad part and the socket pad part.
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