EQUIPMENT FOR CONTROLLING WAFER TEMPERATURE OF SEMICONDUCTOR ETCHING DEVICE

摘要

A device for controlling wafer temperature in a semiconductor etching system is provided to prevent defects of a wafer due to cooling errors by controlling a flow rate of helium corresponding to the temperature of the wafer. An electrostatic chuck(40) comprises a helium gas inlet and a helium gas outlet for cooling a wafer. A temperature detection sensor senses the temperature of the wafer loaded on the electrostatic chuck. A conversion unit(50) converts a temperature value sensed from a probe sensor to a numerical value, and compares the sensed temperature value with predetermined temperature value in order to output a helium flow control signal. A monitor(52) displays the numerical temperature value. A control unit(56) for helium gas flow rate is installed at a helium supply line in order to control a helium gas flow rate.