| 摘要 |
A method of forming a multilayer printed wiring board including forming a yet-to-cure interlayer dielectric layer by applying or attaching, to a dielectric substrate, an interlayer dielectric material of liquid or dry film including one or more of thermosetting resin, mixture of thermosetting and thermoplastic resins, photosensitized thermosetting resin, mixture of photosensitized thermosetting and thermoplastic resins, and photosensitive resin, softening the dielectric layer, pressing mold having convexities onto the softened dielectric layer to form concavities for conductor and concavities or through-holes for viaholes, cooling or heating the softened dielectric layer to temperature at which shapes of the concavities and/or through-holes in the dielectric layer are maintained, removing the mold from the dielectric layer, heating, or irradiating ultraviolet rays to, the dielectric layer, and curing, by heating, the dielectric layer, and forming the circuits and viaholes by forming a conductive material in the concavities and/or through-holes in the cured dielectric layer.
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