| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a package exhibiting high airtightness at the solder joint of a metallic base member and a frame-like ceramic substrate. SOLUTION: The airtight package comprises a metallic bottom plate 1, a frame-like ceramic substrate 2 arranged on the metallic bottom plate 1, and a metallic lid 3 covering the hollow section of the frame-like ceramic substrate 2. A frame-like metal bump 5, having a curved surface 5a projecting downward, is formed on the surface of the frame-like ceramic substrate 2 opposing the metallic bottom plate 1, and a solder 4 is provided for bonding the frame-like metal bump 5 with the metallic bottom plate 1. COPYRIGHT: (C)2008,JPO&INPIT
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