| 摘要 |
An electronic device includes a heating structure including a sub-mount for mounting an LED chip thereon, a first solder layer for bringing the LED chip and the sub-mount into junction and a heat releasing structure including a first metal layer and a graphite layer stacked onto the first metal layer, wherein the heating structure is mounted on the graphite layer side of the heat releasing structure. The electronic device includes a second metal layer being present on a plane in the graphite layer opposite to a plane where the first metal layer is stacked; and the second metal layer and the sub-mount are brought into junction with a second solder layer so that the heating structure and the heat releasing structure are thereby brought into junction.
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