| 摘要 |
A chip capacitor which can be miniaturized with structural stability. In the chip capacitor, a capacitor device has a cathode layer formed on an outer surface thereof and an anode wire is protruded from a portion thereof. A cathode lead is electrically connected to the cathode layer. An anode lead is electrically connected to the anode wire through a weld reinforcement. A molding is configured to cover the capacitor device in such a way that the cathode and anode leads are only partially exposed. Protrusions are protruded from outer surfaces of the cathode and anode leads, respectively, thereby forming steps on the outer surfaces thereof. In the chip capacitor, the leads and molding are bonded with much greater strength, thus more structurally robust. Also, this prevents external moisture from penetrating inside the chip capacitor, thereby significantly enhancing moisture resistance.
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