| 摘要 |
A micromechanical cap structure and a corresponding manufacturing method are described. The micromechanical cap structure includes a first wafer with a micromechanical functional structure, and a second wafer to form a cap over the micromechanical functional structure. The first and second wafers have in their interior a support structure with a metal-semiconductor contact, and in their edge zone a bonding structure. The edge zone of the second wafer, when in the capped state, is arched in relation to the interior of the second wafer.
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