CONDUCTOR FOIL WITH ADHESIVE LAYER, CONDUCTOR-CLAD LAMINATE, PRINTED WIRING BOARD AND MULTILAYER WIRING BOARD

摘要

Disclosed is a conductor foil with adhesive layer which enables to produce a printed wiring board having excellent heat resistance wherein transmission loss especially in high frequency band can be reduced and interlayer separation can be sufficiently suppressed. Also disclosed is a conductor-clad laminate. Specifically disclosed is a conductor foil with adhesive layer comprising a conductor foil and an adhesive layer formed on the conductor foil.The adhesive layer is composed of a curable resin composition containing a polyfunctional epoxy resin as a component (A), a polyfunctional phenol resin as a component (B), and a polyamideimide as a component (C). Also specifically disclosed is a conductor-clad laminate comprising an insulating layer, a conductor layer arranged opposite to the insulating layer, and an adhesive layer interposed between the insulating layer and the conductor layer. The adhesive layer is composed of a cured product of the resin composition containing the components (A), (B) and (C).