| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board where an insulating material is covered in a gap and surrounding of a thick circuit pattern in a state of high quality and can inhibit a peeling defect. SOLUTION: The multilayer printed wiring board manufacturing method, in which a thick circuit pattern 5 is located in an inside layer portion of a printed wiring board, includes a process which sticks a multilayer printed wiring board, that is composed of one interlayer insulator where an insulator 2 between the thick circuit pattern 5 and a conductor layer of an upper layer is formed by uniting a resin located in the gap and surface of the thick circuit pattern 5, and a copper foil thicker than upper/lower surface with an insulating as a center in advance, a process which forms a circuit of a thick copper foil to form a circuit pattern, a process which applies a resin on a gap and surface of the circuit pattern, a process which keeps the resin covered in the gap and surface of the circuit pattern in a semi-harden state, and laminates a sheet-like resin and a copper foil on the resin in order, and unites the laminated layers by heating, and process which locates a connection via on the circuit pattern to connect with a conductor of the upper layer. COPYRIGHT: (C)2008,JPO&INPIT |
