发明名称 |
LIGHT EMITTING DIODE MODULE |
摘要 |
A light emitting diode module is provided to improve a beam angle of an LED emission light by attaching a lens to cover a peripheral region of a printed circuit board which is mounted on a package. A light emitting diode module includes a printed circuit board(101), at least one LED package(100), and a lens. The LED package(100) is surface-mounted on the printed circuit board(101). The lens is attached on the printed circuit board so as to cover the whole top surface of the LED package(100) and a part of the top surface of the printed circuit board(101) adjacent to the LED package(100). The LED package(100) includes an LED package body part(104) having a mounting region, an LED chip(102) mounted on the mounting region, and a resin packaging part(105) to seal the LED chip(102).
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申请公布号 |
KR20070104029(A) |
申请公布日期 |
2007.10.25 |
申请号 |
KR20060036107 |
申请日期 |
2006.04.21 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
SONG, YOUNG JAE;KIM, CHANG WOOK |
分类号 |
H01L33/58 |
主分类号 |
H01L33/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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