| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board in which the adhesion strength of an insulating layer and a wiring conductor can be increased without forming the projection and recession on the surface. SOLUTION: A wiring board 3 includes a core substrate 4, a plurality of wiring conductors 2, an insulating layer 5, and a via conductor 9. An alloy 10 constituted of materials including the alloy of copper and tin is formed in the predetermined region of the surface section of the wiring conductor 2, so that it is possible to smooth the surface of the wiring board 2, and to increase the bonding strength of the wiring conductor 2 and the insulating layer 5. COPYRIGHT: (C)2008,JPO&INPIT |
