METHOD FOR PRODUCING AN ELECTRONIC MODULE BY MEANS OF SEQUENTIAL FIXATION OF THE COMPONENTS, AND CORRESPONDING PRODUCTION LINE

摘要

The invention relates to a method for producing an electronic module (2) comprising a printed circuit (4) board (3), at least one first type of component (5), and a second type of component (6), said method comprising the following steps: solder (8) is placed on the board; the first type of component is placed in position; the board is generally heated in order to melt the solder in such a way as to solder the first type of component; the second type of component is positioned in such a way that it has tongues (7) which are supported on the board by means of solder; and the solder is locally heated such that it melts in order to solder the second type of component. The invention also relates to a production line for implementing said method.