发明名称 CURABLE EPOXY RESIN COMPOSITION
摘要 <p>Disclosed is a curable epoxy resin composition characterized by containing a compound having a benzoxazole structure represented by the general formula (I) below. (I) (In the formula, X&lt;SUP&gt;1&lt;/SUP&gt; and X&lt;SUP&gt;2&lt;/SUP&gt; independently represent a hydrogen atom, a substituent having a phenolic hydroxyl group or a substituent having an epoxy group (provided that X&lt;SUP&gt;1&lt;/SUP&gt; and X&lt;SUP&gt;2&lt;/SUP&gt; are not hydrogen atoms at the same time), alternatively X&lt;SUP&gt;1&lt;/SUP&gt; and X&lt;SUP&gt;2&lt;/SUP&gt; may be crosslinked with each other to form a saturated or unsaturated heterocyclic ring having 3-8 atoms which has a substituent having a phenolic hydroxyl group or a substituent having an epoxy group; Y&lt;SUP&gt;1&lt;/SUP&gt; represents an oxygen atom or a sulfur atom; Z&lt;SUP&gt;1&lt;/SUP&gt; represents an optionally substituted hydrocarbon group having 1-8 carbon atoms or an optionally substituted alkoxy group having 1-8 carbon atoms; m represents an integer of 0-4, and when m is an integer of 2-4, a plurality of Z&lt;SUP&gt;1&lt;/SUP&gt;'s may be the same as or different from each other; n represents an integer of 0-2; and A&lt;SUP&gt;1&lt;/SUP&gt; represents a hydrogen atom, a substituent having a phenolic hydroxyl group or a substituent having an epoxy group.)</p>
申请公布号 WO2007111136(A1) 申请公布日期 2007.10.04
申请号 WO2007JP55106 申请日期 2007.03.14
申请人 ADEKA CORPORATION;MORI, TAKAHIRO 发明人 MORI, TAKAHIRO
分类号 C08G59/26;C07D235/18;C07D263/56;C08G59/40 主分类号 C08G59/26
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