| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device in which the connection pad of a semiconductor element does not cause poor contact even when the mounting position of the semiconductor element is shifted from a package substrate, and the diameter of a connection land provided in the wiring in order to connect a via is not required to be enlarged; and to provide its manufacturing process. <P>SOLUTION: The semiconductor device comprises a substrate 110, a semiconductor element 120 mounted on the substrate 110 and having a connection pad 121 on the surface, an insulation layer 134 formed on the substrate 110 and the semiconductor element 120, a wiring 143 formed on the insulation layer 134, and a via 132 for connecting the connection pad 121 and the wiring 143. At least one of the vias 132 is formed while inclining the center line against the surface of the substrate 110. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
