发明名称 Light-focusing solar chip package comprises covering encapsulating solar chip, substrate and wiring connection structures, focusing sunlight, and comprising anti-reflective structure to benefit sunlight absorption
摘要 <p>A light-focusing package structure comprises a substrate (14) supporting a solar chip (12), wiring connection structures (16) electrically coupled to the solar chip, and a covering (18) encapsulating the solar chip, substrate and wiring connection structures, focusing sunlight, and comprising an anti-reflective structure to benefit sunlight absorption. The covering is formed by plastic injection-molding, mold-filling, or filling epoxy into a mold. It may be a transparent cap or a hollow pipe.</p>
申请公布号 DE102006010276(A1) 申请公布日期 2007.09.13
申请号 DE20061010276 申请日期 2006.03.02
申请人 HIGHER WAY ELECTRONIC CO. LTD.;MILLENNIUM COMMUNICATION CO. LTD. 发明人 LAI, LI-HUNG;LAI, LI-WEN;HUANG, KUN-FANG;HSIEH, WEN-SHENG;LIN, CHIA-HUNG;SHIH, LI-CHIEH
分类号 H01L31/0232;H01L31/052;H01L31/102 主分类号 H01L31/0232
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