发明名称 |
Light-focusing solar chip package comprises covering encapsulating solar chip, substrate and wiring connection structures, focusing sunlight, and comprising anti-reflective structure to benefit sunlight absorption |
摘要 |
<p>A light-focusing package structure comprises a substrate (14) supporting a solar chip (12), wiring connection structures (16) electrically coupled to the solar chip, and a covering (18) encapsulating the solar chip, substrate and wiring connection structures, focusing sunlight, and comprising an anti-reflective structure to benefit sunlight absorption. The covering is formed by plastic injection-molding, mold-filling, or filling epoxy into a mold. It may be a transparent cap or a hollow pipe.</p> |
申请公布号 |
DE102006010276(A1) |
申请公布日期 |
2007.09.13 |
申请号 |
DE20061010276 |
申请日期 |
2006.03.02 |
申请人 |
HIGHER WAY ELECTRONIC CO. LTD.;MILLENNIUM COMMUNICATION CO. LTD. |
发明人 |
LAI, LI-HUNG;LAI, LI-WEN;HUANG, KUN-FANG;HSIEH, WEN-SHENG;LIN, CHIA-HUNG;SHIH, LI-CHIEH |
分类号 |
H01L31/0232;H01L31/052;H01L31/102 |
主分类号 |
H01L31/0232 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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