摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wafer machining method capable of supplying a wafer diced by a laser dicing apparatus to a later process without cutting. <P>SOLUTION: The wafer machining method comprises: a first mechanical machining step for grinding the back of the wafer W, polishing the back of the wafer after grinding, and machining the back of the wafer to a thickness T2 that is thicker than a final machining thickness T1 of the wafer by 50-500μm; a modified region formation step for forming a modified region in the inside by applying laser beams to the wafer after the first mechanical machining; and a second mechanical machining step for grinding the back of the wafer after forming the modified region, polishing the back of the wafer after grinding, and machining the back of the wafer to the final machining thickness T1 of the wafer. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |