| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a structure by which a cost of a package substrate of a semiconductor device can be reduced in compared with a case wherein a multilayer wiring board of four layers or six layers, etc. is used. <P>SOLUTION: A plurality of vias provided to the package substrate 3 of a BGA 7 comprise: first through holes 3e lead out in a plane direction by leading wirings 3h connecting to lands 3d; and second through holes 3g acting as pad-on vias arranged on the lands 3d. Thereby high-densification of wirings and high function of BGA 7 are enabled by using the package substrate 3 of a two-layer wiring structure. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
