METHOD OF MANUFACTURING ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a method for reducing occurrence of non-deposition or defect of a plating film after electrolytic plating by suppressing the dissolution of a seed film. SOLUTION: A method of manufacturing an electronic component includes: a seed film forming step (S110) of forming a seed film on a substrate; a cooling step (S112) of cooling the seed film; and a plating step (S114) of immersing the cooled seed film in a plating liquid, and performing electrolytic plating using the seed film as a cathode. COPYRIGHT: (C)2007,JPO&INPIT