| 摘要 |
A camera device and a manufacturing method thereof are provided to form an opening for installation on a PCB(Printed Circuit Board) and fix an image sensor to the opening for installation, thereby reducing height of the camera device. A camera device comprises the following parts: a lens module(110) to which an image of a subject is applied; a PCB(Printed Circuit Board)(120) which is arranged in a side of the lens module and in which an opening for installation is formed; and an image sensor(130) which is arranged in the opening for installation of the PCB and electrically connected with the PCB. The image sensor is mounted on the same plane as the PCB or on a plane lower than the same plane.
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