发明名称 Transfer of Force from Manifold to Plate of Hot Runner of Injection Molding System Usable for Molding Metal Alloy
摘要 Disclosed is an injection molding system usable for molding of a metal alloy above a solidus temperature of the metal alloy, the injection molding system, having a hot runner, including: (A) a manifold plate, and (B) a manifold abutting the manifold plate, the manifold having a drop, the manifold configured to transfer a load to the manifold plate along a direction extending inclined relative to the drop. Disclosed is a hot runner of an injection molding system usable for molding of a metal alloy above a solidus temperature of the metal alloy, the hot runner, including: (A) a manifold plate; and (B) a manifold abutting the manifold plate, the manifold having a drop, the manifold configured to transfer a load to the manifold plate along a direction extending inclined relative to the drop.
申请公布号 US2007193713(A1) 申请公布日期 2007.08.23
申请号 US20070689618 申请日期 2007.03.22
申请人 HUSKY INJECTION MOLDING SYSTEMS LTD. 发明人 MANDA JAN M.;GLASFORD ZAC;KESTLE MARTIN R.
分类号 B22D17/00;B22D17/20;B29C45/00;B29C45/03;B29C45/17;B29C45/20;B29C45/26;B29C45/27 主分类号 B22D17/00
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