| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate inspection apparatus capable of inspecting an open circuit and a short circuit in a wiring pattern without contacting any probe with a land, by irradiating a metal surface with laser light and utilizing the phenomenon that a negatively charged particle is emitted from the metal surface. SOLUTION: The substrate inspection apparatus 1 comprises: a laser light emitting means 22 for irradiating a first inspection point of the wiring pattern with the laser light which causes one or both of a photo-electric effect phenomenon and a laser ablation phenomenon to occur, and causing the charged particle to be emitted therefrom; a trapping electrode 14c for trapping the charged particle emitted from the first inspection point; a voltage applying means 16 for applying a prescribed magnitude of voltage across the trapping electrode and a second inspection point so that the potential of the trapping electrode is higher than that of the first inspection point; and a current detecting means 18 which is connected to the voltage applying means in series and detects a value of current flowing between the trapping electrode and the second inspection point. A trapping electrode having a reflecting function for turning the laser light is used as above-mentioned trapping electrode. COPYRIGHT: (C)2007,JPO&INPIT
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