| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board whereon a plurality of conductor circuit patterns are formed and a plurality of electronic components are mounted, and which is prevented from warping and deformation, thereby allowing very accurate mounting of electronic components; and to provide a method of manufacturing the same. SOLUTION: On the top and bottom faces of a discarded portion 22 of a printed wiring board 20 connected to a product substrate 21 through connectors 23, a solder resist 35 and a solder resist 36 are applied which are so selected as to have different material properties. COPYRIGHT: (C)2007,JPO&INPIT |
