| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To obtain a surface-mounting electronic component for reducing the risk of short-circuiting due to the solder reservoirs between adjacent lead terminals. <P>SOLUTION: In the surface-mounting electronic component, a plurality of lead terminals 15 project from a side 11 in a package 10 incorporating electron devices. In the surface mount electronic component, a recess 16 for preventing solder wicking is formed at the lead terminals 15 and is formed at different positions regarding the longitudinal direction of the lead terminals 15 between adjacent lead terminals 15. Solder melted in soldering becomes a solder reservoir at the recess 16 by rising up each lead terminal, thus preventing adjacent solder reservoirs from contacting each other since the recess is formed at different positions in the longitudinal direction of the lead terminals 15. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
