| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which can effectively prevent breakage of a semiconductor wafer, and can favorably perform a semiconductor device manufacturing process. SOLUTION: A circular notch is formed in an manner such that a blade 21 is abutted vertical to one main surface of a semiconductor wafer 11, and the blade 21 is rotated. Then the blade 21 is moved in the circumferential direction of the semiconductor wafer 11. The process for forming the circular notch is carried out several times, whereby, a reinforcement portion 11a having the thickness of semiconductor wafer 11 before grinding is formed on the semiconductor wafer 11. The reinforcement portion 11a functions as a reinforcement member when a semiconductor manufacturing process, such as process for transferring the semiconductor wafer 11, diffusion process, metal film forming process etc. is carried out. COPYRIGHT: (C)2007,JPO&INPIT
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