| 摘要 |
A hybrid non-abrasive electrical test contact element of a test socket is taught. Unlike cantilever contact elements of the prior art, the contact element of the present invention is able to contact a lead of an integrated circuit device under test without abrading the plating on the lead. This is achieved by the contact element possessing multiple loops to allow the tip of the contact element to move not only downwards, but also sideways in a rocking and non-sliding motion. The tip of the contact is also shaped to contact the lead at only a radius corner of each lead so as not to affect the solderability of the lead. In addition, tests have shown that the contact element of the present invention has at least twice the working life span compared to another contact element of the prior art.
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