METHOD FOR MANUFACTURING RIGID-FLEXIBLE PRINTED CIRCUIT BOARD

摘要

A method for manufacturing a rigid-flexible printed circuit board is provided to reliably form a minute circuit on a PCB(Printed Circuit Board) by forming a thickness of a flexible board to be different from a thickness of a rigid board. A base board(110) with an inner layer circuit pattern is formed on at least one surface of a polyimide film. The polyimide film is molded on a flexible board region except for a terminal portion of the inner layer circuit pattern. Prepregs(140) are formed on upper and lower surfaces of the base board corresponding to the rigid board region. An outer layer copper plate(200) with a thickness corresponding to the rigid and flexible boards is formed on the prepregs. A thickness of an outer layer copper plate corresponding to the rigid board region is reduced. The outer layer circuit pattern is formed on the rigid board region of the outer layer copper plate. The portion of the outer layer copper plate corresponding to the flexible board is removed.