| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a hybrid multilayer circuit board where a burr is not made during processing of through-holes, and the surface of a copper foil of an outer layer material in the case of stacking is protected from sticking of a foreign matter in the manufacturing method of the hybrid multilayer circuit board. SOLUTION: In the manufacturing method of the hybrid multilayer circuit board having a structure where a cable B is pulled out from a multilayer part A; a resin coat 5 is formed on the surface of the copper foil of the outer layer at a multilayer and the through-holes 61 and 62 are worked with a drill through the resin coat. COPYRIGHT: (C)2007,JPO&INPIT |
