发明名称 |
Packaging for an interferometric modulator |
摘要 |
A package is made of a transparent substrate having an interferometric modulator and a back plate. A non-hermetic seal joins the back plate to the substrate to form a package, and a desiccant resides inside the package. A method of packaging an interferometric modulator includes providing a transparent substrate and manufacturing an interferometric modulator array on a backside of the substrate. A back plate is provided and a desiccant is applied to the back plate. The back plate is sealed to the backside of the substrate with a back seal in ambient conditions, thereby forming a package.
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申请公布号 |
US2007170568(A1) |
申请公布日期 |
2007.07.26 |
申请号 |
US20070653088 |
申请日期 |
2007.01.12 |
申请人 |
PALMATEER LAUREN;GALLY BRIAN J;CUMMINGS WILLIAM J;KOTHARI MANISH;CHUI CLARENCE |
发明人 |
PALMATEER LAUREN;GALLY BRIAN J.;CUMMINGS WILLIAM J.;KOTHARI MANISH;CHUI CLARENCE |
分类号 |
H01L23/02;G02B26/00 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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