发明名称 Method for manufacturing surface acoustic wave device
摘要 A surface acoustic wave device which occupies a small mounting area and has a low profile, yet having an improved reliability, and can be made available at low cost. The surface acoustic wave device comprises a piezoelectric substrate, a function region formed of comb-like electrodes for exciting surface acoustic wave provided on a main surface of the piezoelectric substrate, a space formation member covering the function region, a plurality of bump electrodes provided on a main surface of the piezoelectric substrate and a terminal electrode provided opposed to the main surface of piezoelectric substrate. The bump electrode and the terminal electrode are having a direct electrical connection, and a space between piezoelectric substrate and terminal electrode is filled with resin. When the above-configured acoustic wave device is applied for a frequency filter, a resonator, in a portable telephone unit, a keyless entry or the like communication apparatus, the overall size of such apparatus can be reduced and a higher reliability is implemented.
申请公布号 US7246421(B2) 申请公布日期 2007.07.24
申请号 US20050220815 申请日期 2005.09.07
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 NAMBA AKIHIKO;ONISHI KEIJI;SUGAYA YASUHIRO;MORITOKI KATSUNORI
分类号 H04R17/00;H01L21/68;H01L41/00;H03H3/08;H03H9/05 主分类号 H04R17/00
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