A wafer level bonding apparatus using elasticity is provided to realize proper lamination of a chip-to-wafer or a wafer-to-wafer regardless of a thickness of semiconductor chips or the wafer by uniformly distributing pressure from a pressing unit to each part of a bonding head through a pressure distribution device. A first wafer(2) and second chips(3) or a second wafer are mounted on a bonding stage(10). The first wafer includes first chips(1). The second chips are aligned on the first wafer through an adhesive layer(4). A bonding head(20) vertically moves to an upper portion corresponding to the bonding stage to laminate the second chips or the second wafer on the first wafer through thermal compression. A pressing device(30) vertically moves the bonding head to an upper portion of the bonding head. A pressure distribution device(40) between the pressing device and the bonding head uniformly distributes the pressure from the pressing device to the whole bonding head. The bonding head includes a heating plate(21) and an elastic member(25). The heating plate generates heat. The elastic member is contacted to the second chips or the second wafer on a lower portion of the heating plate to apply the heat from the heating plate and the pressure by the pressure distributing device.
