发明名称 Semiconductor device using a conductive film and method of manufacturing the same
摘要 A semiconductor device has a capacitive element including a first conductive film formed on the bottom and wall surfaces of an opening formed in an insulating film on a substrate, a dielectric film formed on the first conductive film, and a second conductive film formed on the dielectric film. The dielectric film of the capacitive element is crystallized. The first and second conductive films are made of a polycrystal of an oxide, a nitride or an oxynitride of a noble metal.
申请公布号 US7244982(B2) 申请公布日期 2007.07.17
申请号 US20060487969 申请日期 2006.07.18
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 NATSUME SHINYA;HAYASHI SHINICHIRO
分类号 H01L27/108;H01L21/02;H01L21/316;H01L21/8242;H01L27/105;H01L29/76;H01L29/94;H01L31/119 主分类号 H01L27/108
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