SEMICONDUCTOR INTEGRATED CIRCUIT MOUNTING MODULE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit mounting module having effectively controlled noise generated during high-speed operation with a flexible simplified method without manufacture of an exclusive circuit board. SOLUTION: The semiconductor integrated circuit mounting module 100 is allocated between a semiconductor integrated circuit 200 and a circuit board 300 in order to mount the semiconductor integrated circuit 200 on the circuit board 300. This semiconductor integrated circuit mounting module 100 includes: a connecting means 130 for respectively connecting each terminal in the side of the integrated circuit 200 and each terminal in the side of the circuit board 300; and a noise rejecting means 150 for bypassing noise element through connection between a connecting means 120 corresponding to a power supply terminal of the semiconductor integrated circuit 200 and a connecting means 110 corresponding to a ground terminal of the semiconductor integrated circuit 200. COPYRIGHT: (C)2007,JPO&INPIT