发明名称 |
OPTOELEKTRONISCHE BAUELEMENTANORDNUNG UND VERFAHREN ZUR HERSTELLUNG EINER OPTOELEKTRONISCHEN BAUELEMENTANORDNUNG |
摘要 |
In an optoelectronic component assembly and a method for the production thereof, the optoelectronic component assembly includes an optoelectronic component arranged on a support element, which is surrounded by a closed dam. An encapsulation is arranged in an inner area of the dam, which encapsulates the optoelectronic component and includes two sealing materials. The inner area of the dam may be filled with a first sealing material up to the top edge of the optoelectronic component. The inner area of the dam located above the optoelectronic component is filled with a second transparent sealing material at least in one area of the window. |
申请公布号 |
DE50210203(D1) |
申请公布日期 |
2007.07.05 |
申请号 |
DE2002510203 |
申请日期 |
2002.03.30 |
申请人 |
DR. JOHANNES HEIDENHAIN GMBH |
发明人 |
RISSING, LUTZ;OBERMAYER, FLORIAN;SCHROLL, FLORIAN |
分类号 |
H01L23/29;H01L31/0203;H01L23/31;H01L27/14;H01L31/02;H01L33/00 |
主分类号 |
H01L23/29 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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