Method for detaching a semiconductor chip from a foil and device for mounting semiconductor chips

摘要

The detachment of a semiconductor chip ( 1 ) from a foil ( 4 ) and picking the semiconductor chip ( 1 ) from the foil ( 4 ) takes place with the support of a chip ejector ( 6 ), that has a ramp ( 16 ), the surface ( 17 ) of which is formed concave and ends at a stripping edge ( 18 ) projecting from the surface ( 9 ) of the chip ejector ( 6 ), and a support area ( 13 ) with grooves ( 12 ) arranged next to the stripping edge ( 18 ). Vacuum can be applied to the grooves ( 12 ). The detachment and picking of the semiconductor chip ( 1 ) from the foil ( 4 ) takes place in that the wafer table ( 5 ) is shifted relative to the chip ejector ( 6 ) in order to pull the foil ( 4 ) over the stripping edge ( 18 ) protruding from the surface ( 9 ) of the chip ejector ( 6 ), whereby the semiconductor chip ( 1 ) temporarily detaches itself at least partially from the foil ( 4 ) and lands on the foil ( 4 ) above the support area ( 13 ), and in that the chip gripper ( 7 ) picks the semiconductor chip ( 1 ) presented on the support area ( 13 ).