| 摘要 |
PROBLEM TO BE SOLVED: To enable printing of a conductive paste uniformly with high positional accuracy, even when a double-sided CCL of FPC is used as a start-up material, and to surely prevent adhesives and sticking substances from remaining on the printed conductor. SOLUTION: In manufacturing a substrate 30 for a multilayered printed wiring board, which has a via hole 33 filled with the conductive paste 31 for interlayer conduction; a mask CCL 20, formed with a circuit according to a pattern 24 with a circuit pattern L2 inverted on the printed surface side of a double-sided substrate 10 is used as a printing mask, and a through-hole 16 for a via-hole of the double-sided substrate 10 is filled with the conductive paste 31 through a through-hole 25 formed in the mask CCL 20. According to this method, the substrate 30 for the multilayered printed wiring board can be manufactured, without limiting the types of the start-up material, such as FPC and RPC. This substrate 30 can be used for manufacturing a multilayered substrate by stacking it on other substrates. COPYRIGHT: (C)2007,JPO&INPIT |
