| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat sink which can be bonded to a board in parallel with the surface of the board, even if placed to be slightly tilted against the surface of the board. SOLUTION: According to the heat sink 10, a semiconductor element 22 mounted on the board 20 is glued to the bottom of a recess 12 opening at one surface of a metal plate via a thermally conductive adhesive layer 18, and radiation fins 26 are joined to the other surface of the metal plate. A plurality of protrusions 16 are formed on a flat surface formed on the opening periphery of the recess 12 of the metal plate, and the projection length of each protrusion 16 is so adjusted that an end face of each protrusion 16 comes in contact simultaneously with the board surface, when the opening surface of the recess 12 of the heat sink 10 is overlaid on the board surface of the board 20 on which semiconductor element 22 is mounted. COPYRIGHT: (C)2007,JPO&INPIT
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