Semiconductor package and its manufacturing method,申请号KR20000086248-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	Semiconductor package and its manufacturing method
摘要
申请公布号	KR100729051(B1)	申请公布日期	2007.06.14
申请号	KR20000086248	申请日期	2000.12.29
申请人		发明人
分类号	H01L23/12	主分类号	H01L23/12
代理机构		代理人
主权项
地址

您可能感兴趣的专利

HIGH SPACE RESOLUTION LIGHT SOURCE FOR MEASURING LIGHT WAVE FAULT IMAGE

ULTRASONIC TRANSMITTER

IMAGE PROCESSING METHOD FOR CIRCULAR HOLE MEASUREMENT BY IMAGE

METHOD FOR MEASURING FILM THICKNESS OF OPTICAL ELEMENT, AND METHOD FOR MANUFACTURING OPTICAL ELEMENT

TEMPERATURE PROCESSING STORAGE

DEVICE AND METHOD FOR METERING POWDER/GRANULE

REFRIGERATING AND AIR CONDITIONING EQUIPMENT

REFRIGERATION DEVICE

FLOAT TYPE STEAM TRAP

AIR CONDITIONER

LONG SIZE HEAT RADIATING PIPE PIPING BASE BOARD OF HOT WATER FLOOR RADIATOR

PORTABLE GAS COOKSTOVE WITH WINDSHIELD

DIAPHRAGM FOR SHOCK ABSORBER

SLIDE RAIL DEVICE

METHOD FOR PRODUCING HIGHLY REACTIVE COKE FOR BLAST FURNACE

COMMUNICATION TERMINAL PROVIDED WITH REMOTE COPY FUNCTION

BURIED ARTICLE MADE OF FRP

METHOD OF PRODUCING Co BASED SPUTTERING TARGET

MAGNETIC DISK UNIT