发明名称 |
Positive resist composition and pattern forming method using the same |
摘要 |
A positive resist composition, which comprises: (A) a resin of which solubility in an alkali developer increases under an action of an acid; (B) a compound capable of generating an acid upon irradiation with actinic rays or radiation; (C) a resin having at least one of a fluorine atom and a silicon atom; and (D) a solvent, wherein the resin (C) contains at least one of: (C1) a resin having at least one of a fluorine atom and a silicon atom and having an alicyclic structure; and (C2) a resin containing a repeating unit having at least one of a fluorine atom and a silicon atom in a side chain and a repeating unit having an unsubstituted alkyl group in a side chain; and a pattern forming method.
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申请公布号 |
EP1795963(A1) |
申请公布日期 |
2007.06.13 |
申请号 |
EP20060025357 |
申请日期 |
2006.12.07 |
申请人 |
FUJIFILM CORPORATION |
发明人 |
KANDA, HIROMI;KANNA, SHINICHI |
分类号 |
G03F7/039;G03F7/004;G03F7/075;G03F7/20 |
主分类号 |
G03F7/039 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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