| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus for preventing a plating liquid dripping from an electronic circuit board from dripping to a power supply part of a plating bath when the electronic circuit board is transferred from the plating bath to a next step. SOLUTION: The plating apparatus 1 is provided with: a holder vertically moving apparatus 27 for charging and pulling up a plating holder 33 for holding the electronic circuit board to be plated to and from the plating bath 9; a plating holder transportation apparatus 21 for transporting the plating holder 33 to the plating bath 9; and a plating liquid receiving pan 95 which is for receiving the plating liquid dripping from the plating holder 33 pulled up from the plating bath 9, is provided to freely moving between a waiting position shifted from a position when the plating holding 33 is charged to the plating bath 9 and pulled up from the plating bath 9 and a position below the plating holder 33 pulled up from the plating bath 9 and is positioned below the plating holder 33 to freely follow when the plating holder 33 is carried out. COPYRIGHT: (C)2007,JPO&INPIT
|
