发明名称 |
FLUSSMITTELFREIE FLIP-CHIP-VERBINDUNG |
摘要 |
A flip chip method of joining a chip and a substrate is described. A thermo-compression bonder is utilized to align the chip and substrate and apply a contact force to hold solder bumps on the substrate against metal bumps on the chip. The chip is rapidly heated from its non-native side by a pulse heater in the head of the bonder until the re-flow flow temperature of the solder bumps is reached. Proximate with reaching the re-flow temperature at the solder bumps, the contact force is released. The solder is held above its re-flow temperature for several seconds to facilitate wetting of the substrate's metal protrusions and joining. Metal caps comprised of a noble metal such as palladium is applied to the surface of the metal bumps to prevent the metal bumps (which generally comprise a highly-conductive and highly-reactive metal such as copper) from oxidizing in the elevated temperatures just prior to and during the re-flow operation. |
申请公布号 |
DE60219779(D1) |
申请公布日期 |
2007.06.06 |
申请号 |
DE2002619779 |
申请日期 |
2002.02.21 |
申请人 |
INTEL CORP. |
发明人 |
KUBOTA, JIRO;TAKAHASHI, KENJI |
分类号 |
H01L23/485;H01L21/60;H01L21/603;H05K3/24;H05K3/34 |
主分类号 |
H01L23/485 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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