| 摘要 |
PROBLEM TO BE SOLVED: To provide a component recognition method and a component mounting method by which one of two dimensional position sensing and three dimensional position sensing of an electronic component can be selected, a time required to mount the electronic component can be shortened to improve the productivity and the reliability can be improved. SOLUTION: A brightness image pick up means 3 for obtaining the brightness image data on the entire bottom face of an electronic component 2, and a height image pick up means 8 for obtaining the height image data on the entire bottom face of the electronic component 2 are provided. Two dimensional position sensing by means of the brightness image pick up means 3 and three dimensional position detection by means of the height image pick up means 8 are independently used, and the position of the electronic component 2 is measured. Thus, for an electronic component requiring lead float inspection, etc., height measurement for load float inspection, etc., can be performed and position sensing required for X, Y and θcorrection can be performed at the same time. |
