| 摘要 |
PROBLEM TO BE SOLVED: To obtain a metallized polyimide film that is obtained by using a polyimide film that keeps heat resistance and flexibility at higher levels and has no warpage of film by heat as a substrate and has excellent heat-resistant surface retention properties. SOLUTION: The metallized polyimide film is obtained by using a polyimide film as a substrate in which a polyimide contains a biphenyltetracarboxylic acid residue as the residue of at least an aromatic tetracarboxylic acid and a phenylenediamine residue as the resistance of an aromatic diamine and which has≤10% curling degree after heat treatment of the film at 300°C and forming a metal thin film layer on the film by dry plating. The metallized polyimide film roll and the flexible printed wiring board are obtained by using polyimide films having≤25% of coefficient of variation (CV%) of coefficient of linear expansion as substrates. COPYRIGHT: (C)2007,JPO&INPIT |
