发明名称 Hot melt adhesive composition based on a random copolymer of isotactic polypropylene and a secondary polymer
摘要 A hot melt adhesive composition is based on an isotactic polypropylene random copolymer (RCP). The composition contains about 4%-50% by weight of the RCP copolymer, about 20%-65% by weight of a compatible tackifier, about 0%-40% by weight of a plasticizer, about 0%-3% by weight of a stabilizer, about 0%-40% by weight of a wax, about 0%-60% by weight of an atactic poly-alpha-olefin (APAO), and about 0%-40% by weight of a secondary polymer. The adhesive composition may be used in a number of applications such as, for example, in disposable nonwoven hygienic articles, paper converting, flexible packaging, wood working, carton and case sealing, labeling and other assembly applications.
申请公布号 US7262251(B2) 申请公布日期 2007.08.28
申请号 US20030694366 申请日期 2003.10.27
申请人 BOSTIK FINDLEY, INC. 发明人 KANDERSKI MONINA DADAP;SVENNINGSEN LACRETIA A.;STRELOW DIANE M.;ZHANG CHONGYAO;GIBES MARK A.;WANG BAOYU
分类号 C08L23/00;C08L23/04;C08L23/14;C09J123/14 主分类号 C08L23/00
代理机构 代理人
主权项
地址
您可能感兴趣的专利